Semiconductor packaging technology enterprises continue to develop, advanced packaging will become the future research trend

Semiconductor packaging technology enterprises continue to develop, barcode scanning solutions advanced packaging will become the future research trend

"So far, the global IC packaging industry has been divided into five stages, from traditional to advanced. precision automation systems The third stage of packaging technology is collectively referred to as advanced packaging technology."

Semiconductor packaging technology continues to evolve, from traditional to advanced.

From the perspective of the industrial chain, the semiconductor industry can be divided into upstream semiconductor equipment and materials industry, midstream semiconductor manufacturing and downstream application industry, midstream semiconductor manufacturing can be divided into optoelectronics, sensors, discrete devices and integrated circuits, integrated circuits can be divided into logic chips, memory chips, analog circuits and microprocessors four categories. In terms of market size, integrated circuits are the core of semiconductor manufacturing, accounting for more than 80% of the semiconductor industry.

From the perspective of manufacturing technology, semiconductor manufacturing solutions the industrial chain of integrated circuits can be divided into three parts: design, manufacturing and packaging and testing, of which the packaging and testing of integrated circuits is the last process of integrated circuit product manufacturing. Most chip design companies adopt the factory-free model, without wafer manufacturing and packaging plant testing. After the chip design is completed, the layout is handed over to the wafer foundry to manufacture wafers, and the wafers are handed over to the downstream packaging and testing enterprises. According to the package type and technical parameters required by customers, the bare chip is processed into integrated circuit components that can be directly assembled on the PCB board. After the package is completed, according to the requirements of customers, the voltage, current, time, temperature, resistance, capacitance, frequency, pulse width, duty cycle and other parameters of the chip product are professionally tested. Packaging and testing enterprises deliver finished chips to customers after completing the packaging and testing of wafer chips, and obtain revenue and profits.